The terminal is made of nickel-plated copper, and the front screw hole is bent 90° downward

1. Structure of glass-encapsulated resistors

As the name implies, the glass-encapsulated resistor has the remarkable feature that the resistor body is encapsulated by glass material. This encapsulation method not only provides good electrical insulation performance, but also effectively protects the resistor body from the influence of the external environment, such as moisture and corrosion. Structurally, glass-encapsulated resistors are mainly composed of the following parts:

1. **Resistor body**: It is usually made of high-resistivity materials such as manganese-copper alloy and nickel-chromium alloy, and is formed into a slender strip or film with a certain resistance value through precision processing.

2. **Lead-out terminal**: The two ends of the resistor body are connected to the lead-out terminal through the metallization layer. The lead-out terminal usually uses tinned copper wire or nickel-plated copper strip, which is easy to solder to the circuit board.

3. **Glass encapsulation layer**: The resistor body and the lead-out terminal are completely wrapped by molten glass material to form a sealed structure. This layer of glass not only provides electrical insulation, but also plays a role in mechanical protection and moisture resistance.

2. Characteristics of glass-encapsulated resistors

Glass-encapsulated resistors have a series of excellent performance characteristics with their unique packaging process:

1. **High precision**: Due to the close combination of glass and resistor body during the packaging process, the influence of temperature change on resistance value is reduced, making glass-encapsulated resistors have higher precision and stability.

2. **High reliability**: The glass packaging layer effectively isolates the external environment, improves the moisture and corrosion resistance of the resistor, and is suitable for long-term work in harsh environments.

3. **Good temperature characteristics**: Glass packaging can effectively suppress the thermal stress caused by temperature changes in the resistor body, thereby maintaining a good temperature coefficient, which is suitable for applications in a wide temperature range.

4. **Miniaturization**: With the advancement of packaging technology, the volume of glass-encapsulated resistors is getting smaller and smaller, adapting to the trend of miniaturization and integration of electronic products.